Optimization of the Copper Plating Process Using …
In this study, the correlation between the rotational speed of the Cu-RDE and the velocity profile of the copper plating solution near a microvia during the …
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Optimization of High-Speed Electrolytic Plating of Copper Pillar …
Abstract. Cu plating bath for high-speed electrodeposition of Cu pillar was designed in consideration of a flat top morphology of pillar and a pillar height uniformity. An ideal polarization curve was assumed for the flat top morphology. To obtain the ideal polarization curve, an effect of organic additive concentration and solution agitation on the …
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Is it Time to Revisit your Plastic Metallization Process?
The plating on plastics (POP) market has evolved to include an ever-broader range of substrates, huge increases in selective plating demand, using tools such as two-shot molding and laser ablation. Understanding the impact of each component of the process and the interaction within the process, allows for a process to be engineered to …
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0RGHUQ(OHFWURSODWLQJ Copper Electrodeposition: …
Optimization of copper electroplating process applied for microfabrication on flexible polyethylene terephthalate substrate Nguyen Ngan Le, Thi Cam Hue Phan, Anh Duy Le et al.-Aspect-Ratio-Dependent Copper Electrodeposition Technique for Very High Aspect-Ratio Through-Hole Plating Pradeep Dixit and Jianmin Miao-
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Three-Dimensional Integrated Circuit (3D IC) Key Technology …
There are four types of optimization approaches to enhance the filling efficiency, including anode position optimization, a multi-step TSV filling process, additive concentration, and plating current density optimization . Finally, CMP is used to remove the Cu overburden as well as barrier layer from the wafer surface.
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Copper voids improvement for the copper dual damascene …
The optimization of the BTA content in the Cu-CMP slurry is critical to the continuous improvement of process integration on the elimination of Cu voids, ... M. Toben, S. Menard, Optimization of damascene feature fill for copper electroplating process, in: Proceedings of Interconnect Technology, IEEE International Conference, 24–26 May …
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Micromachines | Free Full-Text | Process …
In order to obtain high-quality through-silicon via (TSV) arrays for high voltage applications, we optimized the fabrication processes of the Si holes, evaluated the dielectric layers, carried out hole filling by …
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Process challenges of high-performance silicon …
Fig. 1 presents the surface morphologies of electrodes with screen- (a), (c) and copper-plating (b), (d) process, respectively. The screen-printed finger width is around 44 μm and the morphology of silver finger is unsmooth. It can be seen there are also some silver particles near the silver finger on the ITO film, which could be ascribed to the …
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Process Optimization Explained
Process optimization is a set of methods and tools used to make processes more efficient and effective. There are several types of process optimization techniques, including process mapping, process mining, and Six Sigma. When optimizing a process, it's important to identify goals, analyze current processes, develop an optimized process, …
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Stepwise recovery of Ni, Cu, Zn, and Cr: A green route to …
The recovery of heavy metals from electroplating sludge not only reduces environmental damage, but also avoids the wastage of resources. However, acid leaching of electroplating sludge requires lengthy procedures for purification and separation of metals, which leads to high material consumption. In this study, alkali-leaching dealumination and …
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A Quality by Design Approach for Coating Process Parameter Optimization
Quality by design approach was explored to optimize the tablet coating process using Opadry®, an optimized one step film coating system. A central composite design was chosen by considering ...
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Optimization and effect of pH on treatability of metal plating
Metal plating industry wastewater is a highly toxic wastewater due to its heavy metal and cyanide. This characteristic of wastewater is due to different types of processes used in the metal plating industry. In order to meet discharge limits for the receiving environment, classical chemical treatment methods are widely applied in this …
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Process optimization of electrocoagulation reactor for …
Recently Thirugnanasambandham et al. [15] treated egg processing industry wastewater by EC process using stainless steel as an electrode and optimized through (CCD) RSM. In this work, data is collected through the different experimental conditions of EC process and RSM and full factorial CCD is implemented for the process optimization.
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Treatment of metal plating wastewater using iron electrode …
The results obtained demonstrate that EC is an effective technique in galvanic effluents treatment, and the sludge generated in this process showed to be appropriated to be reused in inorganic pigment production, and could be considered as an alternative to reduce the environmental impact related to electroplating process.
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Optimization and Improvement of Plastic Decoration using Chrome Plating
Electroplating process has lot variables which sometimes result in poor adhesion of plating layer and poor corrosion resistance. Experts have been continuously working over to improve the plating adhesion, corrosion resistance life and to control rejections. Over the years, the chrome plating manufacturing process has been upgraded.
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Electrocoagulation Treatment of Electroplating Wastewater…
Semmens, M. J., C. D. Dillon, and C. Riley. 2001. "An evaluation of continuous electrodeionization as an in-line process for plating rinsewater recovery." Environ. Prog. 20 (4): 251 ... "Post-treatment of molasses wastewater by electrocoagulation and process optimization through response surface analysis." J. Environ. Manage. 164 (Dec ...
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Prediction and optimization of phosphorus content in …
Hence, it is suitable for describing the nonlinear relationship between electroless Ni-P plating process conditions and coating performance [13], [14], [15]. H. Beygi et al. [16] have studied the prediction of plating rate by using neural network and obtained the optimal process parameters efficiently.
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Optimization of plating process and corrosion …
Optimization of plating process and corrosion behavior of nanocrystalline Ni-Mo coatings on pure aluminum - ScienceDirect. Colloids and Surfaces A: …
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Treatment of metal plating wastewater using iron electrode …
In this study, electrocoagulation (EC) process was used to remove COD, color and several toxic heavy metals from metal plating wastewater and central composite design (CCD) combined with response surface methodology (RSM) were applied for optimizing the operating parameters of the process, which utilized iron (Fe) electrodes. The interaction …
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Process to Produce High Aspect Ratio Electroplated …
2.3 Electroplating process . The patterned wafers were sent to Semitool for Cu electroplating. The wafers were plated up to 80% of the resist film thickness by using the plating conditions listed in Table 2. Only minimal descum is needed due to the high photoresist contrast. After electroplating, the photoresist was easily removed in AZ ®
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Review—Management of Copper Damascene Plating …
After acceptance of the tool, optimization of the process for the product or products of interest should be conducted. The optimization process has as its goal the …
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Brush Nickel Plating and Heavy Metal Wastewater …
Second, a Nickel Brush Plating process that generates a considerable amount of waste in the process of washing plated parts. As part of recommendations to reduce waste for the process, the group provided the company with two different leads on newer equipment for plating purposes: Sifco Applied Surface Concepts and Liquid Development Company.
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(PDF) Optimization of Wafer Singulation …
This paper presents a wafer singulation process optimization by using a Cu/Low-k metallized wafer as part of the effort to enhance the processing yield and quality.
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Application of the surface planer process to Cu pillars and …
The surface planer process was carried out immediately after the plating process, without stripping of the photoresist. That is, the removal process was simultaneously carried out on the photoresist and Cu pillars. ... Modeling and optimization of machining parameters during grinding of flat glass using response surface …
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Electroless Nickel Plating – A Review | Silicon
The operating process, versatility and the increasing research interest in optimising the process and products technology in the electroless plating method of metal coating, particularly, the electroless nickel plating of metallic substrates such as mild steel, necessitates the writing of this review. It is also aimed at providing more literature …
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Effect of integrated anneal optimizations of electroplated …
The significance of this paper is to emphasize wafer scale electrochemical plating process optimizations to demonstrate yield-limiting defects reduction. A multiple process enhancement has been implemented to reduce metal "stress-induced" voids, crater defects, Cu mound, as well as other killer defects. ... optimization of ramp rates to ...
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Process development and applications of a dry film …
viii LIST OF ILLUSTRATIONS Figure Page
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(PDF) Design of Experiment (DOE) Analysis with Response
Identifying optimum process parameters, their effects, and contributions to the outcomes of electroplating thickness in the electroplating process is very time-consuming and requires high cost.
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Improvement of substrate and package warpage by copper plating process …
High substrate warpage can lead to unacceptable yield loss during chip attach in assembly, and cause high yield fallout during package mount on the circuit board. For the first time, through this work, the electrolytic copper (Cu) plating process in substrate manufacturing was shown to contribute significantly to package warpage. For a 14×14mm package, …
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Wafer Scale Cu Plating Process Optimization for
Detail failure analysis will also be presented to correlate the post plating defect with the localized absence of Cu-seed along the trench side wall where Cu did not nucleate during plating. The ...
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