Grinding | Solutions | DISCO Corporation
The TAIKO process is the name of a wafer back grinding process. This method is different to conventional back grinding. When grinding the wafer, the TAIKO process leaves an edge (approximately 3 mm) on the outer most circumference of the wafer and thin grinds only the inner circumference. By using this method, it lowers the risk of thin wafer ...
اقرأ أكثر
Evaluation of grinding characteristics for sapphire …
The grinding process of sapphire is less stable and prone to brittle fracture which significantly limits the grinding quality [7]. The researches of the material removal …
اقرأ أكثر
Edge chipping of silicon wafers in diamond grinding
A silicon wafer was thinned by the 600 diamond wheel (grinding mode: down-grinding, down-feed rate: 20 μm/min, other parameters are shown in Table 1) from 700 μm to 100 μm thickness and the edge chipping was measured when wafer thickness was thinned in a 50 μm step size. The measurement data are listed in Table 2.
اقرأ أكثر
Abrasive Grain Efficiency and Surface Roughness …
Newly developed cup-type diamond-grinding-wheels with hexagonal pattern were used to grind a hard-to-machine ceramic material, which was represented by single crystal sapphire in the present work. …
اقرأ أكثر
Evaluation of grinding characteristics for sapphire …
Grinding and polishing are the two major approaches to process hard and brittle materials. To some extent, the grinding quality determines the efficiency and …
اقرأ أكثر
Wafer Dicing, Dice Before Grind, Resizing
Wafer Resizing or Coring. By using the circle cut function on the dicing saws, we are able to resize/core wafers to any smaller diameter, including making a flat. We can also offer edge bevelling or edge rounding on the re-sized wafers. Then using our know-how in silicon polishing and cleaning we are able to finish the wafers to low LPD's ...
اقرأ أكثر
The introduction of diamond grinding wheel used in sapphire …
The chamfering grinding wheel is a metal bond diamond grinding wheel and the common size is 1FF1V/9 202*20*30*2.5. The metal base diamond grinding wheel has high toughness and strength, high groove precision, and long service life. The rough grinding of the Sapphire window is processed by a ceramic bond diamond grinding …
اقرأ أكثر
Study on the grinding characteristics of sapphire …
With the proposed assisted grinding method, a small roughness and small subsurface damage of sapphire surface can be obtained by using a diamond wheel with …
اقرأ أكثر
Edge Grinding Wheels
The most common Edge Grinding Wheel contour is the R type (Radius) followed by the F type (Flat w/2 Radius). SMI is able to place up to 9 grooves of these shapes on its 6" and 8" single grit diamond wheels, and up to 8 grooves on its dual grit diamond wheels. Diamond sizes available: Micron size: 15, 20, 28, 35, 50. Specification: SMI is ...
اقرأ أكثر
Studying Crack Generation Mechanism in Single-Crystal Sapphire …
The tool used in the cutting simulation had an edge radius of 60 Å and a rake angle of -10°, modeled as a rigid body having a diamond cubic structure consisting of about 68,500 atoms. MD simulations of orthogonal cutting on the C-plane of sapphire were conducted using LAMMPS (Large-scale Atomistic/Molecular Massively Parallel Simulator) .
اقرأ أكثر
Fracture Behavior of Single-Crystal Sapphire in …
In order to study the anisotropy of fracture toughness and fracture mechanism of single-crystal sapphire, the three-point bending tests and the single-edge V-notch beam (SEVNB) were used to test the …
اقرأ أكثر
Edge Grinding Wheel, Silicon Wafer Chamfering
Features of edge diamond wheel for silicon and sapphire wafer. – Grinded with uniform chamfer width, excellent rigidity. – Strong groove shape retention, long life. – By edge grinding the final diameter is adjusted. – A uniform diamond layer minimizes machining damage. – Highly precise slotted shape support various wafer shapes.
اقرأ أكثر
Sapphire Processing | DISCO Technology Advancing the Cutting Edge
The leading manufacturing method of sapphire is EFG (Edge-defined Film-fed Growth). In this method, the seed crystal is pulled out of the melt very slowly in order to grow the desired crystal axis and crystal face. Currently, Φ6 inch sapphire production has become common, and its use in industrial applications is further expanding.
اقرأ أكثر
Edge Grinding
Edge grinding, also known as Edge Profiling, is a process that is common to the manufacture of nearly all semiconductor related wafers and wafers that are used in the manufacture of many other electronic, solar, and nanotechnology devices. ... Sapphire, or GaN materials, such as those associated with the manufacture of Light Emitting …
اقرأ أكثر
Edge Grinding Characteristics of Display Glass …
Grinding force (Fy) in the vertical direction was much larger than grinding force (Fx) in the horizontal direction, causing a large compressive stress acting on the grinding glass edge. Grinding torque …
اقرأ أكثر
Efficient and Precise Grinding of Sapphire Glass …
Abstract. In this paper, in view of low grinding efficiency and poor ground surface quality of sapphire glass, the coarse diamond grinding wheel dressed by dry impulse electrical discharge was …
اقرأ أكثر
Beveling Wheel for Wafer | NORITAKE CO.,LIMITED
Beveling Wheel and Notched Wheel for Silicon and Sapphire Wafers. Grinding wheel for bevel machining of semiconductor material substrates. Thanks to a design featuring a uniform layer of fine grains and high-precision finishing technology, this grinding wheel makes high-quality, high-precision machining possible with minimal chipping.Both outer ...
اقرأ أكثر
Wafer & Die Grinding & Thinning
Capabilities. Optim Wafer Services has the ability to offer both wafer & individual die grinding or thinning services for one off needs, volume production or prototype products. We are able to grind 100mm – 300mm Silicon wafers down to ~10µ and have demonstrated die thinning to <50um. In addition we are also able to grind Sapphire, Quartz ...
اقرأ أكثر
Ductile-brittle transition behavior in the ultrasonic vibration
Silicon carbide (SiC) ceramics play a key role in various engineering applications due to their desirable properties, however, they are typical hard-brittle materials and famous for their poor machinability. Ultrasonic-assisted grinding, a processing method hybridizing the conventional grinding and ultrasonic vibration (UV) machining, is …
اقرأ أكثر
Diamond Wheels
ID Grinding Tools Sapphire Wafer Back Grinding Wheel Rotary Grinding Wheel PCD,PCBN Grinding Wheel Made of vitrified bond ... Metal Edge Grinding Wheel 1. Wheel Type: 1FF6Y, 1LL6Y 2. Diamond Grain Size: 325# ~ 800# 3. Bond System: Metal bond, Resin bond 4. Concentration: 100 ~ 125%
اقرأ أكثر
Edge wheel for silicon and sapphire wafer edge grinding
Edge wheel/ chamfering wheels for silicon and sapphire wafer edge grinding. A small diamterer wheel for notch grinding. Metal diamond wheel for rough grinding to get accurate edge profile.
اقرأ أكثر
Sapphire sheet edge polishing method
The invention relates to a sapphire sheet edge polishing method. The method polishes sapphire sheet edges through a diamond polishing wheel comprising a diamond wire lock and a base in the steps of Step one: stacking and fixing 50-100 square sapphire in the thickness of 0.2 mm-0.3 mm together; Step two: mounting the diamond polishing wheel …
اقرأ أكثر
Sapphire single crystals grown by the modified EFG
Unique physical properties of sapphire, along with advantages of the Edge-defined Film-fed Growth (EFG) technique, yield fabrication of the THz waveguides and fibers with a complex cross-section ...
اقرأ أكثر
Edge Grinding Machines｜Semiconductor Manufacturing …
High-rigidity grinder is the device to grind the hard and brittle materials such as sapphire and Sic substrates that are considered to be hard-to-cut materials. CMP Applications are …
اقرأ أكثر
Edge Grinding — Aptek Industries Inc.
Edge grinding, aka Edge Profiling, is critical to the manufacturing of all semiconductor wafers and wafers that are used in the manufacture of many other processes, such as …
اقرأ أكثر
Backgrinding Wax Adhesive Solutions for SiC, Sapphire, …
Typical wafer backgrinding tape has 200 to 1000 gm/inch peel bond strength. This is adequate for relatively soft, easy to thin silicon wafers. However: e.g. SiC (silicon carbide), Sapphire, GaN, GaAs and other III-V semiconductors. Shear bond strength of traditional wafer backgrinding tape is insufficient. Innovated by AIT. Proven by Application.
اقرأ أكثر
Properties of Sapphire Wafers, Sapphire Thermal Conductivity
Sapphire related services include, Sapphire wafer back-thinning, edge grinding, edge rounding, diameter reduction, hole drilling, chamfering, blending and polishing, v-grooves, surface pyramid structures, laser slag removal, slots and steps.
اقرأ أكثر
Edge Grinding Characteristics of Display Glass …
Workpiece size was 300 × 50 × 0.7 mm for the edge grinding tests. Figure 1 is a close view of the edge grinding experimental setup. A specially designed vise was used to clamp the display glass substrate …
اقرأ أكثر
Study on high efficient sapphire wafer processing by …
The Ni Al intermetallic-bonded diamond grinding block containing 5 wt% Cu 3 Sn with flexural strength of 89 MPa and porosity of 0.67 % presents the best grinding performance for sapphire. After grinding, the wear rate, wear ratio and surface roughness of the sapphire are 319.93 mm 3 /min, 36.9 and 1.09 μm, respectively. The proper …
اقرأ أكثر
Investigation into the anisotropy of cross-grinding surface …
Sapphire is a typical difficult-to-machine material, and ultra-precision grinding is the dominant technology used to achieve the required surface quality. 5 It has been reported that high surface integrity can be obtained if the grinding process is conducted in ductile regime. 6,7 Early studies about sapphire grinding were mainly based on the …
اقرأ أكثر